Apple’s anticipated foldable iPhone is set to launch alongside the iPhone 18 Pro and iPhone 18 Pro Max in September 2026, featuring the new A20 Pro chip. This information comes from industry analyst Jeff Pu, who detailed the specifications of these premium devices in a recent investor note.
A20 Pro Chip Specifications
The A20 Pro chip will be manufactured using TSMC’s advanced 2nm N2 process, which is expected to deliver performance improvements of up to 15 percent faster speeds and 30 percent greater efficiency compared to the A19 chip. This enhanced chip design will also incorporate TSMC’s Wafer-Level Multi-Chip Module (WMCM) technology, allowing for integrated RAM directly on the same wafer as the CPU, GPU, and Neural Engine. This integration is anticipated to enhance performance for Apple Intelligence applications while optimizing battery life and reducing the overall size of the A20 chip.
Power Delivery Enhancements
In addition to the WMCM technology, the A20 Pro chip will utilize new super-high-performance metal-insulator-metal (SHPMIM) capacitors. These capacitors are designed to double the capacitance density of previous generations and significantly lower both sheet and via resistance by 50 percent. The result is improved power stability, enhanced performance, and better energy efficiency.
Shared Specifications and Design Features
The iPhone Fold and iPhone 18 Pro models are expected to share several key specifications, including 12GB of LPD5 RAM, 48-megapixel rear cameras, and Apple’s C2 modem. The foldable iPhone is rumored to feature a wide, book-style design with a 7.8-inch inner display and a 5.5-inch outer display. Notably, it may include a crease-free screen, Touch ID functionality, and a front-facing camera accessible in both folded and unfolded states. When opened, the device could measure approximately 4.5mm thick, increasing to between 9mm and 9.5mm when closed.
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